タイトル | 情報 |
---|---|
Pkg. Name Name used to describe Renesas packages.
|
W4X5.20R |
Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
WPG |
Package Description Descriptive text for this package.
|
4x5 20 I/O, 0.4mm Pitch, Thin WLCSP w/o solder ball; ATT |
Package Status | Active |
Package Type | WLCSP-TKCURDL |
クラス | PLASTIC |
Package Code The unique identifier of this package.
|
WPG |
カテゴリ | PLASTIC |
Lead Count | 20 |
Pb (Lead) Free | Yes |
長さ | 2.15mm |
幅 | 1.74mm |
Thickness 取り付け高さ or 本体高さ
(外形図をご参照ください) |
0.23mm |
Pitch | 0.4mm |
Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
2.15 x 1.74 x 0.23 |