タイトル 情報
Pkg. Name
Name used to describe Renesas packages.
 W5X5.25H
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WPO
Package Description
Descriptive text for this package.
 25 Ball 5x5 Array UltraThin Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)
Package Status
 Active
Package Type
 WLCSP-BP
クラス
 PLASTIC
Package Code
The unique identifier of this package.
 WPO
カテゴリ
 PLASTIC
Lead Count
 25
Pb (Lead) Free
 Yes
長さ
 2.07mm
幅
 2.07mm
Thickness
取り付け高さ or 本体高さ
(外形図をご参照ください)
 0.28mm
Pitch
 0.4mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.07 x 2.07 x 0.28